مؤتمر
Improvement of solder joint reliability between multilayer ceramic package and printed wiring board by new ceramic material
| العنوان: | Improvement of solder joint reliability between multilayer ceramic package and printed wiring board by new ceramic material |
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| المؤلفون: | Yamaguchi, K., Higashi, M., Yonekura, H., Hamada, N., Kunimatsu, Y. |
| المصدر: | 1997 Proceedings 47th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1997. Proceedings., 47th. :1277-1282 1997 |
| Relation: | 1997 Proceedings 47th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078033857X 9780780338579 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.1997.606340 |