دورية أكاديمية
Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages
| العنوان: | Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages |
|---|---|
| المؤلفون: | Hong, T. H., Beleran, J., Drake, K. Y. S., Wilson, O. P. L., Mehta, G., Librado, G., Zhang, X. R., Surasit, C. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(12):1923-1933 Dec, 2011 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2011.2158106 |