مؤتمر
Multi chip stacking & reliability challenges using TSV-micro C4 solder interconnection for FCCSP TSV package
| العنوان: | Multi chip stacking & reliability challenges using TSV-micro C4 solder interconnection for FCCSP TSV package |
|---|---|
| المؤلفون: | Au, K.Y., Beleran, J.D., Yang, Y.B., Zhang, Y.F., Kriangsak, S.L., Wilson, P.L Ong, Drake, Y.S.Koh, Nathapong, S |
| المصدر: | 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :608-619 Dec, 2011 |
| Relation: | 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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