مؤتمر
Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration
| العنوان: | Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration |
|---|---|
| المؤلفون: | Kwak, Byung-Hyun, Kim, Sung-Hyuk, Park, Young-Bae |
| المصدر: | 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-2 Jan, 2012 |
| Relation: | 2011 IEEE International 3D Systems Integration Conference (3DIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467321891 9781467321884 9781467321907 |
|---|---|
| DOI: | 10.1109/3DIC.2012.6263004 |