Diamond Materials for GaN HEMT near Junction Heat Removal

التفاصيل البيبلوغرافية
العنوان: Diamond Materials for GaN HEMT near Junction Heat Removal
المؤلفون: Sandhu, Rajinder, Gambin, Vincent, Poust, Benjamin, Smorchkova, Ioulia, Lewis, Gregg, Elmadjian, Raffi, Li, Danny, Geiger, Craig, Heying, Ben, Wojtowicz, Mike, Oki, Aaron, Feygelson, Tatyana, Hobart, Karl, Bozorg-Grayeli, Elah, Goodson, Kenneth
المصدر: 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Compound Semiconductor Integrated Circuit Symposium (CSICS), 2012 IEEE. :1-1 Oct, 2012
Relation: 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781467309288
9781467309271
9781467309295
تدمد:15508781
23748443
DOI:10.1109/CSICS.2012.6340119