مؤتمر
Reliability analysis of 3D IC integration packaging under drop test condition
العنوان: | Reliability analysis of 3D IC integration packaging under drop test condition |
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المؤلفون: | Yen-Ju Lee, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang |
المصدر: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :299-302 Oct, 2012 |
Relation: | 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781467316378 9781467316354 9781467316385 |
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تدمد: | 21505934 21505942 |
DOI: | 10.1109/IMPACT.2012.6420286 |