دورية أكاديمية
Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages
| العنوان: | Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages |
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| المؤلفون: | Zhang, J., Hai, Z., Thirugnanasambandam, S., Evans, J. L., Bozack, M. J., Zhang, Y., Suhling, J. C. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(8):1348-1357 Aug, 2013 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2013.2251932 |