مؤتمر
Bonding wire life prediction model of the power module under power cycling test
| العنوان: | Bonding wire life prediction model of the power module under power cycling test |
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| المؤلفون: | Hung, Tuan-Yu, Chin-Chun Wang, Kuo-Ning Chiang |
| المصدر: | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-6 Apr, 2013 |
| Relation: | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467361385 9781467361378 9781467361392 |
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| DOI: | 10.1109/EuroSimE.2013.6529915 |