مؤتمر
Process characterization of thin wafer debonding with thermoplastic materials
| العنوان: | Process characterization of thin wafer debonding with thermoplastic materials |
|---|---|
| المؤلفون: | Phommahaxay, Alain, Jourdain, Anne, Verbinnen, Greet, Woitke, Tobias, Stieber, Ralf, Bisson, Peter, Gabriel, Markus, Spiess, Walter, Guerrero, Alice, McCutcheon, Jeremy, Puligadda, Rama, Bex, Pieter, Van den Eede, Axel, Swinnen, Bart, Beyer, Gerald, Miller, Andy, Beyne, Eric |
| المصدر: | 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-4 Sep, 2012 |
| Relation: | 2012 4th Electronic System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder كن أول من يترك تعليقا!