مؤتمر
Putting the die contour back - Methods in advanced sample preparation for 3D and flip-chip devices
العنوان: | Putting the die contour back - Methods in advanced sample preparation for 3D and flip-chip devices |
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المؤلفون: | Richardson, Chris, Liechty, Gary, Smith, Clay, Karow, Michael |
المصدر: | Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :474-477 Jul, 2013 |
Relation: | 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479912414 9781479904808 |
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تدمد: | 19461542 19461550 |
DOI: | 10.1109/IPFA.2013.6599203 |