مؤتمر
Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study
| العنوان: | Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study |
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| المؤلفون: | Goel, Sandeep Kumar, Adham, Saman, Wang, Min-Jer, Chen, Ji-Jan, Huang, Tze-Chiang, Mehta, Ashok, Lee, Frank, Chickermane, Vivek, Keller, Brion, Valind, Thomas, Mukherjee, Subhasish, Sood, Navdeep, Cho, Jeongho, Lee, Hayden Hyungdong, Choi, Jungi, Kim, Sangdoo |
| المصدر: | 2013 IEEE International Test Conference (ITC) Test Conference (ITC), 2013 IEEE International. :1-10 Sep, 2013 |
| Relation: | 2013 IEEE International Test Conference (ITC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479908592 |
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| تدمد: | 10893539 23782250 |
| DOI: | 10.1109/TEST.2013.6651893 |