مؤتمر
Solutions to catastrophic yield problems in MCM-D interconnection production
| العنوان: | Solutions to catastrophic yield problems in MCM-D interconnection production |
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| المؤلفون: | Hawley, J., Vo, V. |
| المصدر: | Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) Multichip modules and high density packaging Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on. :118-123 1998 |
| Relation: | Proceedings 1998 International Conference on Multichip Modules and High Density Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780348508 9780780348509 |
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| DOI: | 10.1109/ICMCM.1998.670765 |