مؤتمر
Early detection for Cu wire bonding corrosion using accelerated Autoclave reliability test
| العنوان: | Early detection for Cu wire bonding corrosion using accelerated Autoclave reliability test |
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| المؤلفون: | Tai, C. T., Lim, H. Y., Teo, C. H., Audrey Swee, P. J. |
| المصدر: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :309-312 Dec, 2013 |
| Relation: | 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479928323 9781479928347 |
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| DOI: | 10.1109/EPTC.2013.6745733 |