مؤتمر
Pure Bottom-up filling process for efficient TSV metallization
| العنوان: | Pure Bottom-up filling process for efficient TSV metallization |
|---|---|
| المؤلفون: | Ma, Li, Ling, Huiqin, Li, Ming, Sun, Jiangyan, Yu, Xianxian, Li, Yanyan |
| المصدر: | 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :356-359 Aug, 2013 |
| Relation: | 2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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