مؤتمر
Application of construction analysis in MMIC device intrinsic reliability evaluating
العنوان: | Application of construction analysis in MMIC device intrinsic reliability evaluating |
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المؤلفون: | Xin, Liu, Wenxiao, Fang |
المصدر: | 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :1070-1072 Aug, 2013 |
Relation: | 2013 14th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479904983 |
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DOI: | 10.1109/ICEPT.2013.6756644 |