Integration of a 3-D capacitor into a logic interconnect stack for high performance embedded DRAM SoC technology

التفاصيل البيبلوغرافية
العنوان:	Integration of a 3-D capacitor into a logic interconnect stack for high performance embedded DRAM SoC technology
المؤلفون:	Brain, R., Bisnik, N., Chen, H.-P., Neulinger, J., Lindert, N., Peach, J., Rockford, L., Wang, Y., Zhang, K.
المصدر:	IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :299-302 May, 2014
Relation:	2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
قاعدة البيانات:	IEEE Xplore Digital Library