مؤتمر
Integration of a 3-D capacitor into a logic interconnect stack for high performance embedded DRAM SoC technology
العنوان: | Integration of a 3-D capacitor into a logic interconnect stack for high performance embedded DRAM SoC technology |
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المؤلفون: | Brain, R., Bisnik, N., Chen, H.-P., Neulinger, J., Lindert, N., Peach, J., Rockford, L., Wang, Y., Zhang, K. |
المصدر: | IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :299-302 May, 2014 |
Relation: | 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479950164 9781479950188 |
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تدمد: | 2380632X 23806338 |
DOI: | 10.1109/IITC.2014.6831892 |