مؤتمر
Comparison of barrier materials and deposition processes for copper integration
| العنوان: | Comparison of barrier materials and deposition processes for copper integration |
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| المؤلفون: | Moussavi, M., Gobil, Y., Ulmer, L., Perroud, L., Motte, P., Torres, J., Romagna, F., Fayolle, M., Palleau, J., Plissonier, M. |
| المصدر: | Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) Interconnect technology Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International. :295-297 1998 |
| Relation: | Proceedings of the IEEE 1998 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780342852 9780780342859 |
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| DOI: | 10.1109/IITC.1998.704928 |