مؤتمر
Reliability analysis of copper bump interconnection in double-sided power module
| العنوان: | Reliability analysis of copper bump interconnection in double-sided power module |
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| المؤلفون: | Chia-Chi Tsai, Li-Ling Liao, Yen-Fu Su, Hung, Tuan-Yu, Chiang, Kuo-Ning |
| المصدر: | 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. :1-4 Apr, 2015 |
| Relation: | 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479999491 9781479999507 |
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| DOI: | 10.1109/EuroSimE.2015.7103093 |