مؤتمر
Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs
| العنوان: | Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs |
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| المؤلفون: | Wu, J.-Y., Zhang, M.-S., Tan, H.-Z., Guo, Y.-X. |
| المصدر: | 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 IEEE 23rd Conference on. :183-186 Oct, 2014 |
| Relation: | 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems (EPEPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479936410 9781479936434 |
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| تدمد: | 21654107 21654115 |
| DOI: | 10.1109/EPEPS.2014.7103629 |