مؤتمر
Effect of silver alloy bonding wire properties on bond strengths and reliability
| العنوان: | Effect of silver alloy bonding wire properties on bond strengths and reliability |
|---|---|
| المؤلفون: | Jun Cao, JunLing Fan, ZhiQiang Liu, YueMin Zhang |
| المصدر: | 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :93-97 Apr, 2015 |
| Relation: | 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784904090121 9784904090138 |
|---|---|
| DOI: | 10.1109/ICEP-IAAC.2015.7111008 |