مؤتمر
Preparation of reversible thermosets and their application in temporary adhesive for thin wafer handling
العنوان: | Preparation of reversible thermosets and their application in temporary adhesive for thin wafer handling |
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المؤلفون: | Deng, L., Fang, H., Shuai, X., Zhang, G., Wong, C. P., Sun, R. |
المصدر: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1197-1201 May, 2015 |
Relation: | 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781479986095 |
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تدمد: | 05695503 23775726 |
DOI: | 10.1109/ECTC.2015.7159747 |