مؤتمر
Investigation of localized thermal vias for temperature reduction in 3D multicore processors
العنوان: | Investigation of localized thermal vias for temperature reduction in 3D multicore processors |
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المؤلفون: | Zajac, Piotr, Galicia, Melvin, Maj, Cezary, Napieralski, Andrzej |
المصدر: | 2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES) Mixed Design of Integrated Circuits & Systems (MIXDES), 2015 22nd International Conference. :426-430 Jun, 2015 |
Relation: | 2015 MIXDES - 22nd International Conference "Mixed Design of Integrated Circuits & Systems" |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9788363578060 9788363578077 |
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DOI: | 10.1109/MIXDES.2015.7208556 |