مؤتمر
Reliability study of solder interface with voids using an irreversible cohesive zone model
| العنوان: | Reliability study of solder interface with voids using an irreversible cohesive zone model |
|---|---|
| المؤلفون: | Zhu, Lingling, Xu, Yangjian, Zhang, Jicheng, Liang, Lihua, Liu, Yong |
| المصدر: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :915-920 Aug, 2015 |
| Relation: | 2015 16th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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