مؤتمر
Flexibility of anisotropic conductive films (ACFS) bonded CIF(Chip In Flex) package for wearable electronics applications
| العنوان: | Flexibility of anisotropic conductive films (ACFS) bonded CIF(Chip In Flex) package for wearable electronics applications |
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| المؤلفون: | Paik, Kyung W., Kim, Ji-Hye, Kim, Young R. |
| المصدر: | 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2016. :1-4 Jan, 2016 |
| Relation: | 2016 Pan Pacific Microelectronics Symposium (Pan Pacific) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9780988887398 9781944543907 |
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| DOI: | 10.1109/PanPacific.2016.7428422 |