مؤتمر
Study on current and junction temperature stress aging effect for accelerated aging test of Light emitting diodes
| العنوان: | Study on current and junction temperature stress aging effect for accelerated aging test of Light emitting diodes |
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| المؤلفون: | Chih-Ju Chan, Feng-Mao Hsu, Su, Yen-Fu, Chiang, Kuo-Ning |
| المصدر: | 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :62-65 Apr, 2016 |
| Relation: | 2016 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784904090169 9784904090176 |
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| DOI: | 10.1109/ICEP.2016.7486783 |