التفاصيل البيبلوغرافية
العنوان: |
Advanced detection method for polymer residues on semiconductor substrates: 3D/TSV/interposer: Through silicon via and packaging |
المؤلفون: |
Richter, H., Pfitzner, L., Pfeffer, M., Bauer, A., Siegert, J., Bodner, T. |
المصدر: |
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2016 27th Annual SEMI. :472-474 May, 2016 |
Relation: |
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |