مؤتمر
A method to compensate packaging effects on three-axis MEMS accelerometer
| العنوان: | A method to compensate packaging effects on three-axis MEMS accelerometer |
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| المؤلفون: | Chia-Cheng Chang, Hung-Te Yang, Yen-Fu Su, Yu-Ting Hong, Kuo-Ning Chiang |
| المصدر: | 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on. :536-538 May, 2016 |
| Relation: | 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467381215 9781467381208 |
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| تدمد: | 10879870 |
| DOI: | 10.1109/ITHERM.2016.7517594 |