مؤتمر
Properties and reliability of molybdenum-copper-composites for thermal management applications
| العنوان: | Properties and reliability of molybdenum-copper-composites for thermal management applications |
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| المؤلفون: | Seiss, M., Mrotzek, T., Hutsch, T., Knabl, W. |
| المصدر: | 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on. :971-975 May, 2016 |
| Relation: | 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467381215 9781467381208 |
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| تدمد: | 10879870 |
| DOI: | 10.1109/ITHERM.2016.7517651 |