مؤتمر
An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes
| العنوان: | An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes |
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| المؤلفون: | Huang, Yu-Chieh, Huang, Po-Tsang, Wu, Shang-Lin, Hu, Yu-Chen, You, Yan-Huei, Chen, Ming, Huang, Yan-Yu, Chang, Hsiao-Chun, Lin, Yen-Han, Duann, Jeng-Ren, Chiu, Tzai-Wen, Hwang, Wei, Chen, Kuan-Neng, Chuang, Ching-Te, Chiou, Jin-Chern |
| المصدر: | 2016 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2016 IEEE International Symposium on. :1302-1305 May, 2016 |
| Relation: | 2016 IEEE International Symposium on Circuits and Systems (ISCAS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479953417 9781479953400 |
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| تدمد: | 2379447X |
| DOI: | 10.1109/ISCAS.2016.7527487 |