مؤتمر
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
العنوان: | Numerical simulation of thermo-mechanical behavior in high power diode laser arrays |
---|---|
المؤلفون: | Lu, Yao, Nie, Zhiqiang, Zhang, Pu, Wang, Zhenfu, Xiong, Lingling, Wang, Shuna, Wu, Dihai, Liu, Xingsheng |
المصدر: | 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :76-83 Aug, 2016 |
Relation: | 2016 17th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!