Theoretical and numerical study on bulge testing of ground wafer to characterize mechanical properties and residual stress

التفاصيل البيبلوغرافية
العنوان:	Theoretical and numerical study on bulge testing of ground wafer to characterize mechanical properties and residual stress
المؤلفون:	Chen, Pei, Pan, Tian, Sun, Jinglong, Qin, Fei
المصدر:	2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1075-1078 Aug, 2016
Relation:	2016 17th International Conference on Electronic Packaging Technology (ICEPT)
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
ردمك:	9781509013968
DOI:	10.1109/ICEPT.2016.7583312