مؤتمر
Microstructure and electromigration in copper damascene lines
| العنوان: | Microstructure and electromigration in copper damascene lines |
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| المؤلفون: | Arnaud, L., Tartavel, G., Berger, T., Mariolle, D., Gobil, Y., Touet, I. |
| المصدر: | 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296) Reliability physics Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International. :263-269 1999 |
| Relation: | 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780352203 9780780352209 |
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| DOI: | 10.1109/RELPHY.1999.761624 |