مؤتمر
Microstructure and electromigration in copper damascene lines
العنوان: | Microstructure and electromigration in copper damascene lines |
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المؤلفون: | Arnaud, L., Tartavel, G., Berger, T., Mariolle, D., Gobil, Y., Touet, I. |
المصدر: | 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296) Reliability physics Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International. :263-269 1999 |
Relation: | 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual |
قاعدة البيانات: | IEEE Xplore Digital Library |
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