دورية أكاديمية
Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration
| العنوان: | Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration |
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| المؤلفون: | Wang, J., Wang, Q., Wu, Z., Wang, D., Cai, J. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(1):19-26 Jan, 2017 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2016.2626794 |