مؤتمر
Overlay performance of through Si via last lithography for 3D packaging
| العنوان: | Overlay performance of through Si via last lithography for 3D packaging |
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| المؤلفون: | Flack, Warren W., Hsieh, Robert, Kenyon, Gareth, Slabbekoorn, John, Czarnecki, Piotr, Tobback, Bert, Van Huylenbroeck, Stefaan, Stucchi, Michele, Vandeweyer, Tom, Miller, Andy |
| المصدر: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :564-568 Nov, 2016 |
| Relation: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509043699 9781509043682 |
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| DOI: | 10.1109/EPTC.2016.7861543 |