مؤتمر
CVD TaN barrier for copper metallization and DRAM bottom electrode
| العنوان: | CVD TaN barrier for copper metallization and DRAM bottom electrode |
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| المؤلفون: | Paranjpe, A., Bubber, R., Velo, L., Shang, G., Gopinath, S., Dalton, J., Moslehi, M. |
| المصدر: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :119-121 1999 |
| Relation: | Proceedings of the IEEE 1999 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780351746 9780780351745 |
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| DOI: | 10.1109/IITC.1999.787096 |