Dealing with leakage current in TLM and CTLM structures with vertical junction isolation

التفاصيل البيبلوغرافية
العنوان:	Dealing with leakage current in TLM and CTLM structures with vertical junction isolation
المؤلفون:	Bystrova, Svetlana N., Smits, Sander M., Klootwijk, Johan H., Wolters, Rob A. M., Kovalgin, Alexey Y., Nanver, Lis K., Schmitz, Jurriaan
المصدر:	2017 International Conference of Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2017 International Conference of. :1-6 Mar, 2017
Relation:	2017 International Conference of Microelectronic Test Structures (ICMTS)
قاعدة البيانات:	IEEE Xplore Digital Library