Integration for reduction of sub-half-micron center yield fallout

التفاصيل البيبلوغرافية
العنوان: Integration for reduction of sub-half-micron center yield fallout
المؤلفون: Wing Kei Au, Sappidi, J., Parks, D., Delgado, M., Kulkami, M., Costabile, M., Li, J., Gabriel, C.T., Wong, V., Levan, M.
المصدر: 10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295) Semiconductor manufacturing 99 Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI. :18-20 1999
Relation: 1999 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780352173
9780780352179
تدمد:10788743
DOI:10.1109/ASMC.1999.798173