مؤتمر
Construction analysis of flip chip package for aerospace application
| العنوان: | Construction analysis of flip chip package for aerospace application |
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| المؤلفون: | Zhao, L., Kong, Z., Li, Z., Wang, K. |
| المصدر: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :203-206 Aug, 2017 |
| Relation: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538629727 9781538629710 |
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| DOI: | 10.1109/ICEPT.2017.8046438 |