دورية أكاديمية
Development of the wafer level compressive-flow underfill process and its involved materials
| العنوان: | Development of the wafer level compressive-flow underfill process and its involved materials |
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| المؤلفون: | Songhua Shi, Yamashita, T., Wong, C.P. |
| المصدر: | IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 22(4):274-281 Oct, 1999 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 1521334X 15580822 |
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| DOI: | 10.1109/6104.816094 |