دورية أكاديمية

Perfluorocompound Emissions Control and Kinetic Characteristics in Point-of-Use Wet-Thermal-Wet Abatement of Plasma-Enhanced Chemical Vapor Deposition Chamber Cleaning

التفاصيل البيبلوغرافية
العنوان: Perfluorocompound Emissions Control and Kinetic Characteristics in Point-of-Use Wet-Thermal-Wet Abatement of Plasma-Enhanced Chemical Vapor Deposition Chamber Cleaning
المؤلفون: Hu, S., Shiue, A., Tseng, W., Leggett, G.
المصدر: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 31(2):302-308 May, 2018
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
تدمد:08946507
15582345
DOI:10.1109/TSM.2018.2808173