مؤتمر
On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
العنوان: | On the TSV delamination risk dependence on TSV distance and silicon crystal orientation |
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المؤلفون: | Auersperg, J., Albrecht, J., Rzepka, S. |
المصدر: | 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-4 Apr, 2018 |
Relation: | 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781538623596 9781538623589 |
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DOI: | 10.1109/EuroSimE.2018.8369880 |