مؤتمر
On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
| العنوان: | On the TSV delamination risk dependence on TSV distance and silicon crystal orientation |
|---|---|
| المؤلفون: | Auersperg, J., Albrecht, J., Rzepka, S. |
| المصدر: | 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-4 Apr, 2018 |
| Relation: | 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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