مؤتمر
Comprehensive 3D TSV Reliability Study on 14nm FINFET Technology with Thinned Wafers
| العنوان: | Comprehensive 3D TSV Reliability Study on 14nm FINFET Technology with Thinned Wafers |
|---|---|
| المؤلفون: | Premachandran, C.S., Cimino, Salvatore, Ogdan, Sean, Wu, Zhuo-Jie, Smith, Daniel, Kannan, Sukesh, Cao, Linjun, Prabhu, Manjunatha, Yao, Walter, Ranjan, Rakesh, England, Luke, Justison, Patrick |
| المصدر: | 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :37-40 Mar, 2018 |
| Relation: | 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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