التفاصيل البيبلوغرافية
| العنوان: |
Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection Between Cu-Pillar and Sn-Bi Solder Alloy System |
| المؤلفون: |
Murayama, Kei, Aizawa, Mitsuhiro, Oi, Kiyoshi |
| المصدر: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :875-881 May, 2018 |
| Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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