مؤتمر
Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
| العنوان: | Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions |
|---|---|
| المؤلفون: | Janta-Polczynski, Alexander, Cyr, Elaine, Langlois, Richard, Fortier, Paul, Taira, Yoichi, Boyer, Nicolas, Barwicz, Tymon |
| المصدر: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1109-1117 May, 2018 |
| Relation: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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