مؤتمر
Modeling Wafer Bending Effects on RDL Layer Reliability in a Multiple Die Package
| العنوان: | Modeling Wafer Bending Effects on RDL Layer Reliability in a Multiple Die Package |
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| المؤلفون: | Wang, Tzu Chen, Yeh, Chih Chieh, Xu, Xiaopeng, Sayed, Karim EI, Lin, Chun-Hung Steven |
| المصدر: | 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :88-90 Jun, 2018 |
| Relation: | 2018 IEEE International Interconnect Technology Conference (IITC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538643372 9781538643365 |
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| تدمد: | 23806338 |
| DOI: | 10.1109/IITC.2018.8430421 |