مؤتمر
Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material
| العنوان: | Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material |
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| المؤلفون: | Wang, Hu, Yang, Daoguo, Cai, Miao, Wang, Xiyou, Liang, Zhi |
| المصدر: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :904-907 Aug, 2018 |
| Relation: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538663868 9781538663851 |
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| DOI: | 10.1109/ICEPT.2018.8480728 |