مؤتمر
Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material
العنوان: | Thermal Simulation Modeling of IGBT Module Using Silver Nanoparticle Sintering Material |
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المؤلفون: | Wang, Hu, Yang, Daoguo, Cai, Miao, Wang, Xiyou, Liang, Zhi |
المصدر: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :904-907 Aug, 2018 |
Relation: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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